Qualcomm has formally unveiled its next-generation Snapdragon X75, demonstrating once again why it is at the forefront of the 5G modem market. Let’s take a closer look at the several enhancements the baseband chip provides over the Snapdragon X70.
The significant advancement in technology is the inclusion of a hardware tensor accelerator for enhanced AI performance in Qualcomm’s most recent 5G modem. The business also claims that the Snapdragon X75 is the first 10-carrier aggregation 5G modem in the world, with a 10Gbps downlink speed cap on both Wi-Fi 7 and 5G. Since no provider has yet been able to offer speeds so high, the 10Gbps statistic, which is the same as the Snapdragon X70, is already excessive.
Additionally, Qualcomm has used certain novel engineering techniques to lower the power consumption of the Snapdragon X75. The business claims that their new QTM565 mmWave antenna module has been combined with a convergent transceiver, which not only cuts cost but also energy consumption and hardware footprint. It is possible that the 5G modem was mass-produced using TSMC’s 4nm design.
With the Snapdragon X75, the usage of AI has significantly grown, with Qualcomm claiming that this technology would enhance speeds, coverage, dependability, location accuracy, and battery consumption. We anticipate that the Snapdragon 8 Gen 3 and the iPhone 16 family will both have the flagship 5G modem when it becomes available in the second part of 2023.